Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures

Journal of Materials Processing Technology

Volumn 140, Issue 1-3 SPEC., 2003, Pages 173-178

  Lin, C R ^a   Chen, R H ^a   Hung, C ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Analytic; Hot embossing; Shrinkage; Simulation

Indexed keywords

COMPUTER SIMULATION; COOLING; DEFORMATION; MICROSTRUCTURE; PRESSURE EFFECTS; SHRINKAGE;

HOT EMBOSSING;

POLYMETHYL METHACRYLATES;

EID: 0041408761     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00709-X     Document Type: Conference Paper

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3. P.G. Tait, Physics and Chemistry of the Voyage of H.M.S. Challenger, vol. II, Part IV, Scientific Papers LXI, 1888.
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