Thermally enhanced flip-chip BGA with organic substrate

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 685-691

  Matsushima, H ^a   Baba, S ^a   Tomita, Y ^a   Watanabe, M ^a   Hayashi, E ^a   Takemoto, Y ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; INTEGRATED CIRCUIT INTERCONNECTS; NETWORK COMPONENTS; SUBSTRATES; EUTECTICS; FLIP CHIP DEVICES; SOLDERING ALLOYS;

EUTECTIC SOLDERS; FLIP CHIP BGA; FLIP-CHIP INTERCONNECTION; HEAT SPREADERS; HIGH MELTING POINT; HIGH RELIABILITY; HIGH THERMAL; ORGANIC SUBSTRATE;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

BALL GRID ARRAYS (BGA);

EID: 0031636708     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678772     Document Type: Conference Paper

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