Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip HyperBGA package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 359-364

  Xue, Jie ^c   Hubbard, Ken ^c   Li, Phillip ^c   Tang, Jennifer ^c   Poon, Jimmy ^c   Brillhart, Mark ^c   Alcoe, Dave ^a   Kunz, Robert ^a   Mendez, David ^b  

^a EIT   (United States)

^b Solectron   (United States)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ASSEMBLY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HEAT SINKS; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY;

BALL GRID ARRAY PACKAGES; FLIP CHIP BUMPS; SOLDER BALL;

ELECTRONICS PACKAGING;

EID: 0038012819     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. D.J. Alcoe, T.E. Kindl, J.S.Kresge, J.P. Libous, C.L. Tytran-Palomaki, R.J. Stutzman, "A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier," Semicon West, San Jose, CA, 1999.
2. D. Alcoe, M. Jimarez, G. Jones, T. Kindl, J. Kresge, J. Libous, R. Stutzman, C. Tytran-Palomaki, "HyperBGA: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier," IBM MicroElectronics MicroNews, Vol. 6, No. 2, 2Q2000, pp.26-36.
3. D. Alcoe, K. Blackwell, T. Youngs, "Qualification Results of HyperBGA, IBM'S High Performance Flip Chip Organic BGA Chip Carrier," Semicon West, San Jose, CA, 2000.
4. D. Alcoe, K. Blackwell, E. Laine, "Flip Chip Reliability Advances," Advanced Packaging, June, 2000, pp. 39-46.