MPM BGA package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1114-1118

  Zhang, Leilei ^a   Chee, Soon Shin ^a   Maheshwari, Abhay ^a  

^a XILINX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DIES; EMBEDDED SYSTEMS; INTEGRATED CIRCUIT TESTING; INTEGRATED CIRCUITS; RELIABILITY; SOLDERED JOINTS;

BALL GRID ARRAY (BGA) PACKAGES; MULTI PACKAGE MODULE (MPM) PACKAGES;

MULTICHIP MODULES;

EID: 0036294774     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)