Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology

Physics Letters, Section A: General, Atomic and Solid State Physics

Volumn 372, Issue 4, 2008, Pages 519-523

  Yang, Yu Ching ^a   Chang, Win Jin ^a   Fang, Te Hua ^b   Fang, Shih Chung ^a  

^a KUN SHAN UNIVERSITY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Conjugate gradient method; Microthermal machining; Scanning thermal microscopy; Thermal conductance

Indexed keywords

CONJUGATE GRADIENT METHOD; HEAT CONDUCTION; INJECTION MOLDING; METAL CASTING; METAL CASTINGS; METAL MOLDING; SCANNING; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

INJECTION MOLDING PROCESS; INVERSE HEAT CONDUCTION PROBLEM; MICROTHERMAL MACHINING; SCANNING THERMAL MICROSCOPE; SCANNING THERMAL MICROSCOPY; THERMAL CONDUCTANCE; THERMAL CONTACT CONDUCTANCE; TRANSIENT HEAT CONDUCTION;

INVERSE PROBLEMS;

EID: 37549066997     PISSN: 03759601     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physleta.2007.07.047     Document Type: Article

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