Interfacial reactions in the Sn-Bi/Te couples

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 40-44

  Chiu, Chen Nan ^a   Wang, Chao Hong ^a   Chen, Sinn Wen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Cruciform pattern; Interfacial reaction; Sn; Sn Bi; Te

Indexed keywords

CRUCIFORM PATTERN; PRIMARY CONSTITUENT ELEMENTS; REACTION LAYER THICKNESS; THERMOELECTRIC MATERIALS;

FILM THICKNESS; GROWTH RATE; REACTION KINETICS; SURFACE CHEMISTRY;

TIN ALLOYS;

EID: 37249014467     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0264-8     Document Type: Article

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