Effect of rare earth (Ce, La) compounds in the electroless bath on the plating rate, bath stability and microstructure of the nickel-phosphorus deposits

Surface and Coatings Technology

Volumn 202, Issue 9, 2008, Pages 1615-1620

  Ashassi Sorkhabi, H ^a   Moradi Haghighi, M ^a   Hosseini, M G ^a  

^a Faculty of Chemistry   (Iran)

Author keywords

Bath stability; Deposition rate; Electroless nickel plating; Quartz crystal microbalance; Rare earth elements

Indexed keywords

DEPOSITION RATES; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; NICKEL PLATING; RARE EARTH ELEMENTS; SURFACE STRUCTURE;

BATH STABILITY; HYPOPHOSPHITE PLATING BATH;

ELECTROLESS PLATING;

DEPOSITION RATES; ELECTROLESS PLATING; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; NICKEL PLATING; RARE EARTH ELEMENTS; SURFACE STRUCTURE;

EID: 37349116701     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.07.019     Document Type: Article

References (26)

1. Keping H., and Li Fang J. Met. Finish. 95 (1997) 73
2. Howen X., and Bangwei Z. J. Mater. Process. Technol. 124 (2002) 8
3. Wang X.C., Cai W.B., Wang W.J., Liu H.T., and Yu Z.Z. Surf. Coat. Technol. 168 (2003) 300
4. Li G., Tong Y., Wang Y., and Liu G. Electrochim. Acta 48 (2003) 4061
5. Wang K.L., Zhang Q.B., Sun M.L., Wei X.G., and Zhu Y.M. Appl. Surf. Sci. 174 (2001) 191
6. Ichino R., Cachet C., and Wiart R. J. Appl. Electrochem. 25 (1995) 556
7. Kunlin W., Qingbo Z., Xingguo W., and Yunming Z. J. Mater. Sci. 33 14 (1998) 3573
8. Chen M., Muqin L., Ke Y., and Tinghua Z. Zhongguo Xitu Xuebao 14 4 (1996) 330 (ch)
9. Xinghua D. Cailiao Baohu 25 11 (1992) 31 (ch)
10. Guixiang Q., Yundong L., Wei X., Wenzhong J., and Juncheng D. Henan Nongye Daxue Xuebao 35 2 (2001) 179 (ch)
11. Rosalbino F., Angelini E., De Negri S., Saccone A., and Delfino S. Intermetallics 11 (2003) 435
12. Ashassi-Sorkhabi H., and Rafizadeh S.H. Surf. Coat. Technol. 176 (2004) 318
13. Yin X., Hong L., and Chen B.H. J. Phys. Chem., B (2004) 10919
14. Piatti R.C.V., and Podesta J.J. Surf. Coat. Technol. 41 (1990) 333
15. Saurbey G. Z. Phys. 155 (1959) 206
16. Ashassi-Sorkhabi H., Mirmohseni A., and Harrafi H. Electrochim. Acta 50 (2005) 5526
17. Cheong W.J., Luan B.L., and Shoesmith D.W. Appl. Surf. Sci. 229 (2004) 282
18. Chen B.H., Hong L., Ma Y., and Ko T.M. Ind. Eng. Chem. Res. 41 (2002) 2668
19. El-Rehim S.S.A., Shaffei M., El-Ibiari N., and Halem S.A. Met. Finish. 94 (1996) 29
20. W. Riedel, Electroless Nickel Plating, ASM International, Finishing Publications LTD, 1991.
21. Matsushita Y.S., Taogawa S., and Kanbe Y. Met. Finish. (1987) 23
22. Baskaran I., Sankara Narayanan T.S.N., and Stephen A. Mater. Chem. Phys. 99 (2006)
23. Wang L., Tang L., Huang G., Huang W.Q., and Peng J. Surf. Coat. Technol. 192 (2005) 208
24. Lin K.L., and Hwang J.W. Mater. Chem. Phys. 76 (2002) 204
25. Sriram S., Balasubramaniam R., Mungole M.N., Bharagava S., and Baligidad R.G. Corros. Sci. 48 (2006) 1059
26. Dennis J.K., and Such T.E. Nickel and Chromium Plating. Third Edition (1993), Woodhead Publishing Ltd 316