Effects of ligands on electroless Ni-P alloy plating from alkaline citrate-ammonia solution

Surface and Coatings Technology

Volumn 168, Issue 2-3, 2003, Pages 300-306

  Wang, Xu Cheng ^a   Cai, Wen Bin ^a   Wang, Wei Jiang ^a   Liu, Hou Tian ^a   Yu, Zu Zhan ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Alkaline citrate ammonia solution; Ni P alloy coatings; Nickel citrate ammonia complex; X ray fluorescence

Indexed keywords

AMMONIA; CORROSION RESISTANCE; ELECTROLESS PLATING; MORPHOLOGY; PHOSPHORUS; SCANNING ELECTRON MICROSCOPY; SOLUTIONS; STRUCTURE (COMPOSITION); X RAY DIFFRACTION ANALYSIS;

LIGANDS; X RAY FLUORESCENCE ANALYSIS;

NICKEL ALLOYS;

ELECTROLESS PLATING;

EID: 0037461456     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00013-6     Document Type: Article

References (24)

1. S. Jung, T.M. Devine, The 202nd Electrochemical Society Meeting, Meeting Abstracts, Salt Lake City, Utah, 2002, G1-258.
2. A. Brenner, G.E. Riddell, J. Res. Nat. Bur. Stand. 39 (1947) 385-395.
3. R.K. Mayes, Plat. Surf. Finish. 86 (9) (1999) 60-65.
4. G.O. Mallory, J.B. Hajdu, Electroless Plating, AESF, Orlando, FL, 1990, pp. 75-81.
5. H. Yan, New Techniques in Electroless Nickel and Composite Plating, Industry of National Defense Press, Beijing, 2001, p. 1.
6. P.-H. Lo, W.-T. Tsai, J.-T. Lee, M.-P. Hung, J. Electrochem. Soc. 142 (1995) 91-96.
7. R. Stevanovic, J. Stevanovic, A. Despic, J. Appl. Electrochem. 31 (2001) 855-862.
8. S.-L. Lee, H.-H. Liang, Plat. Surf. Finish. 79 (2) (1992) 56-59.
9. K.M. Vanasovskaia, Metalicheskie Pokriti Nanesecie Khimcheskim Sposobom (Metal Deposits Obtained by Chemical Methods), Mashinostroienie, Leningrad, 1985, p. 5.
10. G. Lu, G. Zangari, Electrochim. Acta 47 (2002) 2969-2979.
11. S.-L. Lee, H.-H. Liang, Plat. Surf. Finish. 78 (9) (1991) 82-86.
12. S.L. Chow, N.E. Hedgecock, M. Schlesinger, J. Rezek, J. Electrochem. Soc. 119 (1972) 1614-1619.
13. P.A. Albert, Z. Kovac, H.R. Lilienthal, T.R. Mcguire, Y. Nakamura, J. Appl. Phys. 38 (1967) 1258.
14. R.O. Cortijo, M. Schlesinger, J. Electrochem. Soc. 130 (1983) 2341-2344.
15. M.E. Touhami, M. Cherkaoui, A. Srhiri, A. Ben Bachir, J. Appl. Electrochem. 26 (1996) 487-491.
16. M.E. Touhami, E. Chassaing, M. Cherkaoui, Electrochim. Acta 43 (1998) 1721-1728.
17. E. Valova, S. Armyanov, J.-L. Delplancke, R. Winand, O. Steenhaut, J. Vereecken, J. Electrochem. Soc. 143 (1996) 2804-2815.
18. L.M. Abrantes, J.P. Correia, J. Electrochem. Soc. 141 (1994) 2356-2360.
19. X.-X. Jiang, W. Shen, The Fundamental and Practice of Electroless Plating, Industry of National Defense Press, Beijing, 2000, pp. 12-20.
20. G.O. Mallory, J.B. Hajdu, Electroless Plating, AESF, Orlando, FL, 1990, pp. 6-11.
21. O. Younes, E. Gileadi, J. Electrochem. Soc. 149 (2002) C100-C111.
22. S.O. Niass, M.E. Touhami, N. Hajjaji, A. Srhiri, H. Takenouti, J. Appl. Electrochem. 31 (2001) 85-92.
23. G.O. Mallory, J.B. Hajdu, Electroless Plating, AESF, Orlando, FL, 1990, pp. 26-31.
24. P.L. Cavallotti, G. Salvago, Electrochim. Metall. 3 (1968) 239-266.