Effect of additives on plating rate and bath stability of electroless deposition of nickel-phosphorus-boron on aluminum

Metal Finishing

Volumn 94, Issue 12, 1996, Pages 29-33

  Abd El Rehim, S S ^a   Shaffei, M ^b   El Ibiari, N ^b   Abdel Halem, S ^b  

^a AIN SHAMS UNIVERSITY   (Egypt)

^b NATIONAL RESEARCH CENTRE   (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 24044535498     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-0576(96)80087-0     Document Type: Article

References (9)

1. Gawrilov, G.G., Chemical (Electroless) Nickel Plating, Portcullis Press Ltd., United Kingdom; 1979, p. 36
2. Gutzeit, G., Plating, 47(1):36; 1960
3. Foulke, D.G., U.S. Patent 3,318,711; June 1973
4. Pearlstein, F., U.S. Patent 3,222,195; June 1973
5. Feldstein, N. and P.R. Amadio, Journal of the Electrochemical Society, 117:1110; 1970
6. El-Mallah, A.T. and M.Y. Saada, Metal Finishing, 76(11):62; 1978
7. de Minjer, C.H. and A. Brenner, U.,S. Patent 2,929,6742; June 1973
8. Ramiz, E.R., U.S. Patent 2,884,344; June 1973
9. Schoenberg, L.N., Journal of the Electrochemical Society; November; 1972, p. 1491