New packaging method using PDMS for piezoresistive pressure sensors

Sensors and Materials

Volumn 19, Issue 7, 2007, Pages 391-403

  Yang, Lung Jieh ^a   Wang, Hsin Hsiung ^a   Yang, Po Chiang ^a   Chung, Yung Chiang ^b   Sheu, Tsung Sheng ^c  

^a TAMKANG UNIVERSITY   (Taiwan)

^b MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c DEPARTMENT OF PHYSICS   (Taiwan)

Author keywords

Package; PDMS; Piezoresistive; Pressure sensor

Indexed keywords

EID: 37049015806     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)

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