Sodium contamination in integrated MEMS packaged by anodic bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 626-629

  Schjolberg Henriksen, K ^a   Jensen, G U ^b   Hanneborg, A ^a   Jakobsen, H ^c  

^a UNIVERSITY OF OSLO   (Norway)

^b SINTEF   (Norway)

^c Infineon Technologies SensoNor AS   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CONTAMINATION; ELECTRODES; ELECTRONICS PACKAGING; GATES (TRANSISTOR); INTEGRATED CIRCUIT MANUFACTURE; MOS CAPACITORS; NITRIDES; SILICA; SODIUM; SOLDERING;

ANODIC BONDING; NITRIDE FILM; SODIUM CONTAMINATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0037817765     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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