-
1
-
-
36949018293
-
-
4th ed, McGraw-Hill
-
W. Innys, Newton's Opticks: A Treatise of the Reflections, Refractions and Colours, MDCCLXXX, 4th ed. (McGraw-Hill, 1931), p. 199.
-
(1931)
Newton's Opticks: A Treatise of the Reflections, Refractions and Colours, MDCCLXXX
, pp. 199
-
-
Innys, W.1
-
2
-
-
0001249969
-
A study of glass surfaces in optical contact
-
Lord Rayleigh, "A study of glass surfaces in optical contact," Proc. R. Soc. London, Ser. A 156, 326-349 (1936).
-
(1936)
Proc. R. Soc. London, Ser. A
, vol.156
, pp. 326-349
-
-
Rayleigh, L.1
-
3
-
-
0003577351
-
Over de continuiteit van den gas-en vloeistoftoestand,
-
Ph.D. dissertation Sijthof, in Dutch
-
J. D. Van der Waals, "Over de continuiteit van den gas-en vloeistoftoestand," Ph.D. dissertation (Sijthof, 1873) (in Dutch).
-
(1873)
-
-
Van der Waals, J.D.1
-
4
-
-
84894005265
-
-
F. Twijman and J. H. Dowell, Improvements in or relating to length measurements by interferometer, U.K. patent 367,859 (26 February 1932).
-
F. Twijman and J. H. Dowell, "Improvements in or relating to length measurements by interferometer," U.K. patent 367,859 (26 February 1932).
-
-
-
-
5
-
-
36949023006
-
Laser comprising a block of insulating material containing a channel filled with gas,
-
U.S. patent 3,387,226 4 June
-
J. Haisma and S. J. Van Hoppe, "Laser comprising a block of insulating material containing a channel filled with gas," U.S. patent 3,387,226 (4 June 1968).
-
(1968)
-
-
Haisma, J.1
Van Hoppe, S.J.2
-
6
-
-
0015726621
-
The Philips 'VLP' system
-
K Compaan and P. Kramer, "The Philips 'VLP' system," Philips Tech. Rev. 33, 178-180 (1973).
-
(1973)
Philips Tech. Rev
, vol.33
, pp. 178-180
-
-
Compaan, K.1
Kramer, P.2
-
7
-
-
0023043012
-
Wafer bonding for silicon-on-insulator technologies
-
J. B. Lasky, "Wafer bonding for silicon-on-insulator technologies," Appl. Phys. Lett. 48, 78-80 (1986).
-
(1986)
Appl. Phys. Lett
, vol.48
, pp. 78-80
-
-
Lasky, J.B.1
-
8
-
-
21544462953
-
Silicon-to-silicon direct bonding method
-
M. Shimbo, K. Furukawa, and K. Tanzawa, "Silicon-to-silicon direct bonding method," J. Appl. Phys. 60, 2987-2989 (1986).
-
(1986)
J. Appl. Phys
, vol.60
, pp. 2987-2989
-
-
Shimbo, M.1
Furukawa, K.2
Tanzawa, K.3
-
9
-
-
84860169372
-
Method of manufacturing semiconductor devices,
-
U.S. patent 4,983,251 8 January
-
J. Haisma, Th. M. Michielsen, and J. A. Pals, "Method of manufacturing semiconductor devices," U.S. patent 4,983,251 (8 January 1991).
-
(1991)
-
-
Haisma, J.1
Michielsen, T.M.2
Pals, J.A.3
-
10
-
-
36949002371
-
Bond strength measurements related to silicon surface hydrophilicity
-
The Electrochemical Society Inc
-
U. Gösele, T. Abe, J. Haisma, and M. A. Schmidt, "Bond strength measurements related to silicon surface hydrophilicity," in Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (The Electrochemical Society Inc., 1992), Vol. 92-7.
-
(1992)
Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
, vol.92 -7
-
-
Gösele, U.1
Abe, T.2
Haisma, J.3
Schmidt, M.A.4
-
11
-
-
6744225835
-
Wafer direct bonding: Tailoring adhesion between brittle materials
-
A. Ploszl and G. Kräuter, "Wafer direct bonding: tailoring adhesion between brittle materials," Mater. Sci. Eng. R. R25, 1-88 (1999).
-
(1999)
Mater. Sci. Eng. R
, vol.R25
, pp. 1-88
-
-
Ploszl, A.1
Kräuter, G.2
-
12
-
-
84893985810
-
-
M. H. Vincken, ed., Special issue on direct bonding, Philips J. Res. 49, 1-182 (1995).
-
M. H. Vincken, ed., "Special issue on direct bonding," Philips J. Res. 49, 1-182 (1995).
-
-
-
-
14
-
-
0037023178
-
Contact bonding, including direct bonding in a historical and recent context of materials science and technology, physics and chemistry. Historical review in a broader scope and comparative outlook
-
J. Haisma and G. A. C. M. Spierings, "Contact bonding, including direct bonding in a historical and recent context of materials science and technology, physics and chemistry. Historical review in a broader scope and comparative outlook," Mater. Sci. Eng. R. R37, 1-60 (2002).
-
(2002)
Mater. Sci. Eng. R
, vol.R37
, pp. 1-60
-
-
Haisma, J.1
Spierings, G.A.C.M.2
-
16
-
-
0003008243
-
Surface-related phenomena in the direct bonding of silicon and fused silica wafer pairs
-
J. Haisma and G. A. C. M. Spierings, "Surface-related phenomena in the direct bonding of silicon and fused silica wafer pairs," Philips J. Res. 49, 47-63 (1995).
-
(1995)
Philips J. Res
, vol.49
, pp. 47-63
-
-
Haisma, J.1
Spierings, G.A.C.M.2
-
17
-
-
3843070846
-
Feasibility of immersion lithography
-
S. Owa, H. Nagasaka, Y. Ishii, O. Hirakawa, and T. Yamamoto, "Feasibility of immersion lithography," Proc. SPIE 5377, 264-272 (2004).
-
(2004)
Proc. SPIE
, vol.5377
, pp. 264-272
-
-
Owa, S.1
Nagasaka, H.2
Ishii, Y.3
Hirakawa, O.4
Yamamoto, T.5
-
18
-
-
84894011683
-
Lithographic apparatus and device manufacturing method,
-
U.S. patent publication no. 2005/0110973 26 May 2005
-
B. Streefkerk, J. J. M. Baselmans, P. Graubner, J. Haisma, N. Hattu, Ch. A. Hoogendam, E. R. Loopstra, J. C. H. Mulkens, and B. Gellrich, "Lithographic apparatus and device manufacturing method," U.S. patent publication no. 2005/0110973 (26 May 2005).
-
-
-
Streefkerk, B.1
Baselmans, J.J.M.2
Graubner, P.3
Haisma, J.4
Hattu, N.5
Hoogendam, C.A.6
Loopstra, E.R.7
Mulkens, J.C.H.8
Gellrich, B.9
-
19
-
-
0028747757
-
Improved geometry of double-sided polished parallel wafers prepared for direct bonding
-
J. Haisma, F. J. H. M. Van der Kruis, G. A. C. M. Spierings, J. J. Baalbergen, B. H. Bijsterveld, R. Brehm, J. H. P. M. Faasen, J. J. C. Groenen, P. W. De Haas, T. B. J. Haddeman, T. M. Michielsen, and J. Vijfvinkel, "Improved geometry of double-sided polished parallel wafers prepared for direct bonding," Appl. Opt. 33, 7945-7954 (1994).
-
(1994)
Appl. Opt
, vol.33
, pp. 7945-7954
-
-
Haisma, J.1
Van der Kruis, F.J.H.M.2
Spierings, G.A.C.M.3
Baalbergen, J.J.4
Bijsterveld, B.H.5
Brehm, R.6
Faasen, J.H.P.M.7
Groenen, J.J.C.8
De Haas, P.W.9
Haddeman, T.B.J.10
Michielsen, T.M.11
Vijfvinkel, J.12
-
20
-
-
36949000754
-
Method of making a semiconductor device,
-
U.S. patent 3,239,908 15 March
-
T. Nakamura, "Method of making a semiconductor device," U.S. patent 3,239,908 (15 March 1966).
-
(1966)
-
-
Nakamura, T.1
-
21
-
-
36949000993
-
Diffusion bonding,
-
U.S. patent 3,256,598 21 June
-
I. R. Cramer and C. F. Burrows, "Diffusion bonding," U.S. patent 3,256,598 (21 June 1966).
-
(1966)
-
-
Cramer, I.R.1
Burrows, C.F.2
-
22
-
-
36949000141
-
Monatomic semiconductor devices,
-
U.S. patent 2,743,201 24 April
-
R. P. Johnson, P. Del Rey, R. G. Shulman, and D. M. Van Winkle, "Monatomic semiconductor devices," U.S. patent 2,743,201 (24 April 1956).
-
(1956)
-
-
Johnson, R.P.1
Del Rey, P.2
Shulman, R.G.3
Van Winkle, D.M.4
-
23
-
-
36949014841
-
Electrostatic bonding using externally applied pressure,
-
U.S. patent 4,285,714 25 August
-
A. R. Krikpatrick, "Electrostatic bonding using externally applied pressure," U.S. patent 4,285,714 (25 August 1981).
-
(1981)
-
-
Krikpatrick, A.R.1
-
24
-
-
36949014634
-
Method of manufacturing microstructures and also microstructure,
-
U.S. patent 5,985,412 16 November
-
U. Gösele, "Method of manufacturing microstructures and also microstructure," U.S. patent 5,985,412 (16 November 1999).
-
(1999)
-
-
Gösele, U.1
-
25
-
-
36949015471
-
Process for joining two solid bodies and the resultant structural element,
-
U.S. patent 6,190,778 20 February
-
Ch. Batz-Sohn, G. Kräuter, and U. Gösele, "Process for joining two solid bodies and the resultant structural element," U.S. patent 6,190,778 (20 February 2001).
-
(2001)
-
-
Batz-Sohn, C.1
Kräuter, G.2
Gösele, U.3
-
26
-
-
0032402724
-
Ultra-precision bonding for cryogenic fused-silica optics
-
D.-H. Gwo, "Ultra-precision bonding for cryogenic fused-silica optics," Proc. SPIE 3435, 136-142 (1998).
-
(1998)
Proc. SPIE
, vol.3435
, pp. 136-142
-
-
Gwo, D.-H.1
-
27
-
-
0347343899
-
Ultra-precision and reliable bonding method,
-
U.S. patent 6,284,085 4 September
-
D.-H. Gwo, "Ultra-precision and reliable bonding method," U.S. patent 6,284,085 (4 September 2001).
-
(2001)
-
-
Gwo, D.-H.1
-
28
-
-
3743118643
-
Bond strength measurements related to silicon surface hydrophilicity
-
The Electrochemical Society Inc
-
Y. Backhand, K. Hermansson, and L. Smith, "Bond strength measurements related to silicon surface hydrophilicity," in Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (The Electrochemical Society Inc., 1992), Vol. 92-7, p. 82.
-
(1992)
Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
, vol.92 -7
, pp. 82
-
-
Backhand, Y.1
Hermansson, K.2
Smith, L.3
-
29
-
-
0028381437
-
Characterization of spontaneously bonded hydrophobic silicon surfaces
-
K. Ljungberg, A. Soderbarg, S. Bengtsson, and A. Jauhiainen, "Characterization of spontaneously bonded hydrophobic silicon surfaces," J. Electrochem. Soc. 141, 562-566 (1994).
-
(1994)
J. Electrochem. Soc
, vol.141
, pp. 562-566
-
-
Ljungberg, K.1
Soderbarg, A.2
Bengtsson, S.3
Jauhiainen, A.4
-
30
-
-
36949040252
-
Basic physics of interactions between surfaces in dry, humid and aqueous environments
-
The Electrochemical Society Inc
-
J. N. Isrealachvili, P. MacGuiggan, and R. Horn, "Basic physics of interactions between surfaces in dry, humid and aqueous environments," in Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (The Electrochemical Society Inc., 1992), Vol. 92-7, pp. 33-47.
-
(1992)
Proceedings of the First International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
, vol.92 -7
, pp. 33-47
-
-
Isrealachvili, J.N.1
MacGuiggan, P.2
Horn, R.3
-
32
-
-
36949033717
-
Basics of interactions between flat surfaces
-
Wiley
-
Q.-Y. Tong and U. Gösele, "Basics of interactions between flat surfaces," in Semiconductor Wafer Bonding, Science and Technology, The Electrochemical Society (Wiley, 1999), pp. 17-31.
-
(1999)
Semiconductor Wafer Bonding, Science and Technology, The Electrochemical Society
, pp. 17-31
-
-
Tong, Q.-Y.1
Gösele, U.2
-
34
-
-
0141886241
-
Interconnected reversible lab-on-a-chip technology
-
E. Igata, M. Arundell, H. Morgan, and J. M. Cooper, "Interconnected reversible lab-on-a-chip technology," Lab. Chip 2, 65-69 (2002).
-
(2002)
Lab. Chip
, vol.2
, pp. 65-69
-
-
Igata, E.1
Arundell, M.2
Morgan, H.3
Cooper, J.M.4
-
35
-
-
3142704288
-
Elastic effects on surface physics
-
P. Müller and A. Paúl, "Elastic effects on surface physics," Surf. Sci. Rep. 54, 157-258 (2004).
-
(2004)
Surf. Sci. Rep
, vol.54
, pp. 157-258
-
-
Müller, P.1
Paúl, A.2
-
36
-
-
0000472026
-
Smart-cut: A new silicon-on-insulator material technology based on hydrogen implantation and wafer bonding
-
M. Bruel, B. Aspar, and A.-J. Auberton-Hervé, "Smart-cut: a new silicon-on-insulator material technology based on hydrogen implantation and wafer bonding," Jpn. J. Appl. Phys., Part 1 36, 1636-1641 (1997).
-
(1997)
Jpn. J. Appl. Phys., Part 1
, vol.36
, pp. 1636-1641
-
-
Bruel, M.1
Aspar, B.2
Auberton-Hervé, A.-J.3
-
37
-
-
0003165705
-
A 'Smarter-cut' approach to low temperature silicon layer transfer
-
Q.-Y. Tong, R. Scholz, U. Gösele, T.-H. Lee, L.-J. Huong, Y.-L. Chao, T. Y. Tan, "A 'Smarter-cut' approach to low temperature silicon layer transfer," Appl. Phys. Lett. 72, 49-51 (1998).
-
(1998)
Appl. Phys. Lett
, vol.72
, pp. 49-51
-
-
Tong, Q.-Y.1
Scholz, R.2
Gösele, U.3
Lee, T.-H.4
Huong, L.-J.5
Chao, Y.-L.6
Tan, T.Y.7
-
38
-
-
0142037327
-
Nanoimprint lithography
-
S. Y. Chou, P. R. Krauss, and P. J. Renstrom, "Nanoimprint lithography," Appl. Phys. Lett. 67, 3114-3116 (1995).
-
(1995)
Appl. Phys. Lett
, vol.67
, pp. 3114-3116
-
-
Chou, S.Y.1
Krauss, P.R.2
Renstrom, P.J.3
-
39
-
-
5344268855
-
Mold-assisted nanolithography: A process for reliable pattern replication
-
J. Haisma, M. Verheijen, K. Van den Heuvel, and J. Van den Berg, "Mold-assisted nanolithography: a process for reliable pattern replication," J. Vac. Sci. Technol. B14, 4124-4128 (1996).
-
(1996)
J. Vac. Sci. Technol
, vol.B14
, pp. 4124-4128
-
-
Haisma, J.1
Verheijen, M.2
Van den Heuvel, K.3
Van den Berg, J.4
-
40
-
-
0242664840
-
Pillar-assisted stress-free silicon-on-insulator
-
J. Haisma, "Pillar-assisted stress-free silicon-on-insulator," Appl. Phys. Lett. 83, 3323-3325 (2003).
-
(2003)
Appl. Phys. Lett
, vol.83
, pp. 3323-3325
-
-
Haisma, J.1
-
41
-
-
33748581406
-
Wafer bonding for high performance logic applications
-
Springer, Chap. 5, pp
-
K. W. Guarini and H.-S. P. Wong, "Wafer bonding for high performance logic applications," in Wafer Bonding: Applications and Technology, Materials Science Series (Springer, 2004), Chap. 5, pp. 157-191.
-
(2004)
Wafer Bonding: Applications and Technology, Materials Science Series
, pp. 157-191
-
-
Guarini, K.W.1
Wong, H.-S.P.2
-
42
-
-
33845792490
-
Nanoimprint lithography combined with direct bonding: A possibility to construct quantum dots, wires and planes in vertical cascade
-
J. Haisma, "Nanoimprint lithography combined with direct bonding: a possibility to construct quantum dots, wires and planes in vertical cascade," Appl. Phys. Lett. 89, 244105 (2006).
-
(2006)
Appl. Phys. Lett
, vol.89
, pp. 244105
-
-
Haisma, J.1
-
43
-
-
0001370519
-
Self-limiting oxidation of Si nanowires
-
H. I. Liu, D. K. Biegelsen, N. M. Johnson, F. A. Ponce, and R. F. W. Pease, "Self-limiting oxidation of Si nanowires," J. Vac. Sci. Technol. B11, 2532-2537 (1993).
-
(1993)
J. Vac. Sci. Technol
, vol.B11
, pp. 2532-2537
-
-
Liu, H.I.1
Biegelsen, D.K.2
Johnson, N.M.3
Ponce, F.A.4
Pease, R.F.W.5
-
44
-
-
36949021226
-
Nonvolatile memory device using semiconductor nanocrystals and method of forming same,
-
U.S. patent publication number 0256662 23 December 2004
-
Ch. T. Black, "Nonvolatile memory device using semiconductor nanocrystals and method of forming same," U.S. patent publication number 0256662 (23 December 2004).
-
-
-
Black, C.T.1
-
45
-
-
0032136370
-
Wafer-to-wafer bonding for microstructure formation
-
M. A. Schmidt, "Wafer-to-wafer bonding for microstructure formation," Proc. IEEE 86, 1575-1585 (1998).
-
(1998)
Proc. IEEE
, vol.86
, pp. 1575-1585
-
-
Schmidt, M.A.1
-
46
-
-
36949009981
-
Application of field assisted bonding to the mass production of silicon type pressure transducers,
-
U.S. patent 4,121,334 February 18
-
G. Wallis, "Application of field assisted bonding to the mass production of silicon type pressure transducers," U.S. patent 4,121,334 (February 18, 1978).
-
(1978)
-
-
Wallis, G.1
-
47
-
-
36949005497
-
Inhaler with ultrasonic wave nebulizer having nozzle openings superposed on peaks of a standing wafe pattern
-
1 December
-
J. Hess, H. Bo, R. Weber, I. Ortega, C. Barraud, N. F. De Rooij, and H. Bas, "Inhaler with ultrasonic wave nebulizer having nozzle openings superposed on peaks of a standing wafe pattern," European patent EP1,005,916A1 (1 December 1998).
-
(1998)
European patent EP1,005,916A1
-
-
Hess, J.1
Bo, H.2
Weber, R.3
Ortega, I.4
Barraud, C.5
De Rooij, N.F.6
Bas, H.7
-
48
-
-
0036383417
-
Lab-on-a-chip-based separation and detection technology for life sciences
-
B. H. Weigl and K. Hedine, "Lab-on-a-chip-based separation and detection technology for life sciences," Am. Biotechnol. Lab. 20, 28-30 (2002).
-
(2002)
Am. Biotechnol. Lab
, vol.20
, pp. 28-30
-
-
Weigl, B.H.1
Hedine, K.2
-
49
-
-
34250373501
-
Creating a lab-on-a-chip with microfluidic technologies
-
M. J. Heller and A. Guttman, eds, Dekker
-
A. R. Kopf-Sill, A. W. Chow, L. Bousse, and C. B. Cohen, "Creating a lab-on-a-chip with microfluidic technologies," Integrated Microfabricated Biodevices, M. J. Heller and A. Guttman, eds. (Dekker, 2002), pp. 35-54.
-
(2002)
Integrated Microfabricated Biodevices
, pp. 35-54
-
-
Kopf-Sill, A.R.1
Chow, A.W.2
Bousse, L.3
Cohen, C.B.4
-
50
-
-
0036231855
-
Adapting arrays and lab-on-a-chip technology for proteomics, a review
-
D. Figeys, "Adapting arrays and lab-on-a-chip technology for proteomics, a review," Proteomics 2, 373-382 (2002).
-
(2002)
Proteomics
, vol.2
, pp. 373-382
-
-
Figeys, D.1
-
51
-
-
0037462991
-
Lab-on-a-chip for drug development
-
B. H. Weigl, R. L. Bardell, and C. R. Cabrera, "Lab-on-a-chip for drug development," Adv. Drug Delivery Rev. 55, 349-377 (2003).
-
(2003)
Adv. Drug Delivery Rev
, vol.55
, pp. 349-377
-
-
Weigl, B.H.1
Bardell, R.L.2
Cabrera, C.R.3
-
52
-
-
36949032418
-
Biomems/'Lab-on-a-chip': Towards a cheaper, more rapid, portable and automated high-throughput genotyping
-
World Scientific
-
P. S. Lay and E. P. H. Yap, "Biomems/'Lab-on-a-chip': towards a cheaper, more rapid, portable and automated high-throughput genotyping," in Frontiers in Human Genetics, Diseases and Technologies (World Scientific, 2001), pp. 53-72.
-
(2001)
Frontiers in Human Genetics, Diseases and Technologies
, pp. 53-72
-
-
Lay, P.S.1
Yap, E.P.H.2
|