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Thin Solid Films

Volumn 406, Issue 1-2, 2002, Pages 204-209

Influence of bath chemistry on zincate morphology on aluminum bond pad

(3) Qi, G a Chen, X b Shao, Z b

a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING (Singapore)

Author keywords

Electroless nickel; Wafer bumping; Zincate, aluminum

Indexed keywords

ADHESION; ALUMINUM; ELECTROLESS PLATING; FLIP CHIP DEVICES; MORPHOLOGY; NICKEL; SOLUTIONS; ZINC COMPOUNDS;

BATH CHEMISTRY;

SILICON WAFERS;

EID: 0037051253 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(01)01714-X Document Type: Article

Times cited : (30)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.