Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 299-306

  Datta, Madhumita ^a   Merritt, Scott A ^a   Mario Dagenais, E ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; CMOS INTEGRATED CIRCUITS; ELECTROLESS PLATING; FLIP CHIP DEVICES; METALLIZING; MICROPROCESSOR CHIPS; SEMICONDUCTOR LASERS; SOLDERED JOINTS;

ELECTROLESS REMETALLIZATION; VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL);

ELECTRONICS PACKAGING;

EID: 0033355776     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774749     Document Type: Article

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