Glass wafers bonding via Diels-Alder reaction at mild temperature

Sensors and Actuators, A: Physical

Volumn 141, Issue 1, 2008, Pages 213-216

  Zhang, Minjie ^a,b   Zhao, Jianying ^a   Gao, Lianxun ^a  

^a CHANGCHUN INSTITUTE OF APPLIED CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Bonding; Diels Alder reaction; Glass wafers; Mild temperature

Indexed keywords

BONDING; CLAMPING DEVICES; MICROFLUIDICS; REACTION KINETICS; THERMAL EFFECTS;

CLAMPING FIXTURES; DIELS-ALDER REACTIONS; GLASS WAFERS; HYDROXYLIZATION; MICROFLUIDIC CHIPS;

GLASS;

EID: 36348994909     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.08.001     Document Type: Article

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