Si layer transfer to InP substrate using low-temperature wafer bonding

Applied Surface Science

Volumn 253, Issue 3, 2006, Pages 1243-1246

  Arokiaraj, J ^a   Tripathy, S ^a   Vicknesh, S ^a   Chua, S J ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

InP; Micro Raman; Oxygen plasma; SOI; Thin film; Wafer bonding

Indexed keywords

INDIUM COMPOUNDS; LOW TEMPERATURE EFFECTS; OXYGEN; RAMAN SCATTERING; SILICON WAFERS; SUBSTRATES;

INP; OXYGEN PLASMA; WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 33750683320     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2006.01.071     Document Type: Article

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