Effect of organic acids on copper chemical mechanical polishing

Microelectronic Engineering

Volumn 84, Issue 12, 2007, Pages 2790-2798

  Wu, Yung Fu ^a   Tsai, Tzu Hsuan ^b  

^a MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b TAMKANG UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Copper; Organic acid

Indexed keywords

ADDITIVES; CHEMICAL MECHANICAL POLISHING; CONTAMINATION; COPPER; ELECTRIC IMPEDANCE; POLARIZATION; SLURRIES;

ELECTROCHEMICAL POLARIZATION; GLYCOLIC ACID; OXALIC ACID; PASSIVE FILMS;

ORGANIC ACIDS;

EID: 36148992589     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.01.123     Document Type: Article

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