Characterization of copper chemical mechanical polishing (CMP) in nitric acid-hydrazine based slurry for microelectronic fabrication

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 227-230

  Sekhar, M Surya ^a   Ramanathan, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

Chemical mechanical polishing; Copper; Hydrazine

Indexed keywords

ETCHING; HYDRAZINE; NITRIC ACID; SLURRIES; SURFACE ROUGHNESS;

INHIBITING EFFECT; POLISH RATE; STATIC ETCH RATE;

CHEMICAL MECHANICAL POLISHING;

EID: 33644896780     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.128     Document Type: Conference Paper

References (22)

1. C.K. Hu, B. Luthyer, F.B. Kaufman, J. Humnel, C. Uzoh, and D.J. Pearson Thin Solid Films 262 1995 84
2. J.M. Steigerwald, D.J. Duquette, S.P. Murarka, and R.J. Guttaman J. Electrochem. Soc. 142 1995 2379
3. Q. Luo, D.R. Campbell, and S.V. Babu Thin Solid Films 311 1997 177
4. Q. Luo, S. Ramarajan, and S.V. Babu Thin Solid Films 335 1998 160
5. A. Jindal, and S.V. Babu J. Electrochem. Soc. 151 2004 G709
6. S. Aksu, L. Wang, and F.M. Doyle J. Electrochem. Soc 150 2003 G718
7. S. Seal, S.C. Kuiry, and B. Heinmen Thin Solid Films 423 2003 243
8. T.C. Hu, S.Y. Chiu, B.T. Dai, M.S. Tsai, I.-C. Tung, and M.S. Feng Mater. Chem. Phys. 61 1999 169
9. Q. Luo, D.R. Campbell, and S.V. Babu Langmuir 12 1996 3563
10. M.T. Wang, M.S. Tsai, C. Liu, W.T. Tseng, T.C. Chang, L.J. Chen, and M.C. Chen Thin Solid Films 308-309 1997 518
11. Y. Ein-Eli, E. Abelev, and D. Starosvetshy Electrochim. Acta 49 2004 1499
12. M. Khodari, M.M. Abou-Krishna, F.H. Assaf, F.M. El-Cheikh, and A.A. Hussien Mater. Chem. Phys. 71 2001 279
13. T. Tsai, and S. Yen Appl. Surf. Sci. 210 2003 190
14. D. Zeidler, Z. Stavreva, M. Plotner, and K. Drescher Microelectron. Eng. 33 1997 259
15. Woo-Jin Lee Mater. Sci. Eng., A 348 2003 217
16. T. Du, Y. Luo, and V. Desai Microelectron. Eng. 71 2004 90
17. R. Carpio, J. Farkas, and R. Jairath Thin Solid Films 266 1995 238
18. T. Du, D. Tamboli, Y. Luo, and V. Desai Appl. Surf. Sci. 229 2004 167
19. T. Du, D. Tamboli, V. Desai, and S. Seal J. Electrochem. Soc. 151 2004 G230
20. J. Lu, J.E. Garland, C.M. Pettit, S.V. Babu, and D. Roy J. Electrochem. Soc. 151 2004 G717
21. M.J. Walters, J.E. Garland, C.M. Pettit, D.S. Zimmerman, D.R. Marr, and D. Roy J. Electroanal. Chem. 499 2001 48
22. A.J. Bard, and L.R. Faulkner Electrochemical Methods-Fundamentals and Applications 2nd Edition 2001 John Wiley & Sons