Effect of growth conditions on the structure and properties of tungsten films prepared using a thermal evaporation process

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 25, Issue 6, 2007, Pages 1552-1556

  Hsieh, Chin Tang ^a   Ting, Jyh Ming ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FIELD EMISSION; FILM GROWTH; NANORODS; NANOWIRES; POLYCRYSTALLINE MATERIALS; SILICON; THERMAL EVAPORATION; TUNGSTEN;

CARBON LAYERS; GROWTH CONDITIONS; HIGHER SUBSTRATE TEMPERATURES; X-RAY SPECTRA;

METALLIC FILMS;

EID: 36048989712     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2790913     Document Type: Article

References (34)

1. Y.-H. Lee, C.-H. Choi, Y.-T. lang, E.-K. Kim, B.-K. Ju, N.-K. Min, and J.-H. Ahn, Appl. Phys. Lett. 81, 745 (2002).
2. Y. Baek, Y. Song, and K. Yong, Adv. Mater. (Weinheim, Ger.) 18, 3105 (2006).
3. J. P. Singh, F. Tang, T. Karabacak, T. M. Lu, and G. C. Wang, J. Vac. Sci. Technol. B 22, 1048 (2004).
4. J. G. Flming, S. Y. Lin, I. El-Kady, R. Biswas, and K. M. Ho, Nature (London) 417, 52 (2002).
5. K. Y. Ahn, Thin Solid Films 153, 469 (1987).
6. M. Itoh, M. Hori, and S. Nadahara, J. Vac. Sci. Technol. B 9, 149 (1991).
7. M. S. Aouadi, R. R. Parsons, P. C. Wong, and K. A. R. Mitchell, J. Vac. Sci. Technol. A 10, 273 (1992).
8. P. Petroff, T. T. Sheng, A. K. Sinha, G. A. Rozgonyi, and F. B. Alexander, J. Appl. Phys. 44, 2545 (1973).
9. A. J. Learn and D. W. Foster, J. Appl. Phys. 58, 2001 (1985).
10. K. K. Shih, D. A. Smith, and J. R. Crowe, J. Vac. Sci. Technol. A 6, 1681 (1988).
11. A. M. Haghiri-Gosnet, F. R. Ladan, C. Mayeux, H. Launois, and M. C. Joncour, J. Vac. Sci. Technol. A 7, 2663 (1989).
12. I. A. Weerasekera, S. I. Shah, D. V. Baxter, and K. M. Unruh, Appl. Phys. Lett. 64, 3231 (1994).
13. I.-S. Chang and M.-H. Hon, Thin Solid Films 333, 108 (1998).
14. Y. G. Shen, Y. W. Mai, Q. C. Zhang, D. R. McKenzie, W. D. McFall, and W. E. McBride, J. Appl. Phys. 87, 177 (2000).
15. C. C. Tang and D. W. Hess, Appl. Phys. Lett. 45, 633 (1984).
16. M. J. O'Keefe and J. T. Grant, J. Appl. Phys. 79, 9134 (1996).
17. Y. G. Shen and Y. M. Mai, Mater. Sci. Eng., A 28, 176 (2000).
18. T. Karabacak, A. Mallikarjunan, J. P. Singh, D. Ye, G.-C. Wang, and T.-M. Lu, Appl. Phys. Lett. 83, 3096 (2003).
19. A. Bensaoula, J. C. Wolfe, A. Ignatiev, R-O. Fong, and T.-S. Leung, J. Vac. Sci. Technol. A 2, 389 (1984).
20. S. Basavaiah and S. R. Pollack, J. Appl. Phys. 39, 5548 (1968).
21. J. H. Souk, J. F. O'Hanlon, and J. Angillelo, J. Vac. Sci. Technol. A 3, 2289 (1985).
22. Y. Pauleau, Ph. Lami, A. Tissier, R. Pantel, and J. C. Oberlin, Thin Solid Films 143, 259 (1986).
23. E. K. Broadbent, J. Vac. Sci. Technol. B 4, 1661 (1987).
24. P. Colpo, T. Meziani, N. Gibson, G. Ceccone, and F. Rossi, Surf. Coat. Technol. 863, 116-119 (1999).
25. K. K. Lai and H. H. Lamb, Thin Solid Films 370, 114 (2000).
26. N. Susa, S. Ando, and S. Adachi, J. Electrochem. Soc. 132, 2245 (1985).
27. H. S. Witham, P. Chindandom, I. An, R. W. Collins, R. Messier, and K. Vedam, J. Vac. Sci. Technol. A 11, 1881 (1993).
28. S. M. Rossnage, I. C. Noyan, and C. Cabral, Jr., J. Vac. Sci. Technol. B 20, 2047 (2002).
29. C.-T. Hsieh and J.-M. Ting, Chem. Phys. Lett. 413, 84 (2005).
30. W. I. Milne, A. Hie, J. B. Cui, A. Ferrari, and J. Robertson, Diamond Relat. Mater. 10, 260 (2001).
31. L. Maille, C. Sant, and P. Gamier, Mater. Sci. Eng., C 23, 913 (2003).
32. H. L. Hsiao, H. L. Hwang, A. B. Yang, L. W. Chen, and T. R. Yew, Appl. Surf. Sci. 142, 316 (1999).
33. American Testing Society for Testing and Materials, West Conshohocken, PA, D-3359 Cross-cut tape test for adhesion, 2005.
34. C.-T. Hsieh and J.-M. Ting, Thin Solid Films (to be published).