Activation energy and prefactor for surface electromigration and void drift in Cu interconnects

Journal of Applied Physics

Volumn 102, Issue 8, 2007, Pages

  Choi, Z S ^a   Monig R ^a,b   Thompson, C V ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CATHODES; DIFFUSION IN SOLIDS; ELECTROMIGRATION; SURFACE DIFFUSION;

COPPER DIFFUSIVITY; FLUX DIVERGENCE; PASSIVATED INTERCONNECTS; VOID DRIFT;

COPPER;

EID: 35648978966     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2795663     Document Type: Article

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