Viscoelastic characterization of fast curing moulding compounds

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 462-466

  Milosheva, B V ^a,b   Jansen, K M B ^a   Janssen, J H J ^c   Bressers, H J L ^c   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b BULGARIAN ACADEMY OF SCIENCES   (Bulgaria)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATINGS; MICROELECTRONICS; OPTIMIZATION; PROBLEM SOLVING; RESIDUAL STRESSES; SHRINKAGE; THERMAL EFFECTS; VISCOELASTICITY;

CURE PROCESS; CURING MATERIALS; REACTION SHRINKAGE; VISCOELASTIC PROPERTIES;

THERMOSETS;

EID: 33745698108     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502849     Document Type: Conference Paper

References (7)

1. Hof, C. van't, Ernst L.J, Jansen K.M.B., Yang D.G., Bressers H.J.L., Zhang G.Q., "A Novel Tool for Cure dependent Viscoelastic Characterization of Packiging Polymers", Proceedings of EuroSIME 2004, pp. 385-390, Brussels, Belgium
2. th International Symposium on Macromolecules, Paris, 2004
3. Ernst L.J., et al, "Mechanical Modeling and Characterization of the Curing Process of Underfill Materials", ASME Journal of Electronic Packaging", Vol.124, No.2, pp. 97-105, 2002
4. Hof C. van't, "Mechanical Characterization and Modeling of Curing Thermosets", PhD. Thesis, Delft University of Technology, 2005
5. Yang D.G. et al, "Prediction of Process-Induced Warpage of IC Packages Encapsulated with Thermosetting Polymers", Proceedings of ECTC 2004
6. Product Bulletin of Hysol FP4526, Electronic Materials Division, Dexter Corporation, 1997, pp.1-2
7. Sourour S., Kamal M.R., Theimochimica ACTA 14:41, 1976