Modeling of cure-induced warpage of plastic IC packages

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 33-40

  Yang, D G ^a   Jansen, K M B ^a   Ernst, L J ^a   Zhang, G Q ^b   Van Brief, W D ^c   Bressers, H J L ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PLASTIC MOLDS; POLYMERS; SILICA; THERMAL EFFECTS; VISCOELASTICITY;

CURE-INDUCED WARPAGE; EQUILIBRIUM MODULI; PARTICLE-FILLED POLYMERS; SCALING ANALYSIS;

CHIP SCALE PACKAGES;

EID: 3843090530     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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9. th ECTC, 2004.