Residual stresses in microelectronics induced by thermoset packaging materials during cure

Microelectronics Reliability

Volumn 44, Issue 12, 2004, Pages 1985-1994

  Meuwissen, Marcel H H ^a   De Boer, Hedzer A ^a   Steijvers, Henk L A H ^a   Schreurs, Piet J G ^b   Geers, Marc G D ^b  

^a TNO   (Netherlands)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DYNAMIC MECHANICAL ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PACKAGING MATERIALS; PARAMETER ESTIMATION; RESIDUAL STRESSES; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION; THERMOSETS;

CURE KINETICS; ELECTRONIC PACKAGINGS; MECHANICAL LOADING; THERMAL STRAIN;

MICROELECTRONICS;

EID: 6344282820     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.05.001     Document Type: Conference Paper

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