Constitutive modeling of moulding compounds

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 890-894

  Jansen, K M B ^a   Wang, L ^a   Yang, D G ^a   Van 'T Hof, C ^a   Ernst, L J ^a   Bressers, H J L ^b   Zhang, G Q ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON BLACK; COOLING; ELECTRONICS PACKAGING; FILLERS; HEATING; SILICA; THERMAL CYCLING; VISCOELASTICITY;

CONSTITUTIVE MODELING; ELECTRONIC COMPONENTS; MOULDING; VIRTUAL PROTOTYPING;

EPOXY RESINS;

EID: 10444244832     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Yang, D.G. et al, "Vertical die crack stresses of Flip Chip induced in major package assembly processes", Micorelectronics Reliability (2000), pp. 1533-1538
2. Ernst, L.J. et al, "Time- and temperature dependent thermo-mechanical modeling of a packaging molding compound", J Electron Packaging 125 (2003), pp. 539-548
3. v. Driel, W.D. et al, "Packaging induced die stresses-Effect of chip anisotropy and time-dependent behaviour of moulding compound", J Electron Packaging 125 (2003), pp. 520-525
4. Ernst, L.J., et al, (2002) "Mechanical modeling and characterization of the curing process of underfill materials," Journal of Electronic Packaging, Vol.124 (2002). No. 2, pp. 97-105.