Cure, temperature and time dependent constitutive modeling of moulding compounds

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 581-585

  Jansen, K M B ^a   Wang, L ^a   Van't Hof, C ^a   Ernst, L J ^a   Bressers, H J L ^b   Zhang, G Q ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON BLACK; CURING; ELECTRONICS PACKAGING; ENCAPSULATION; EPOXY RESINS; MATHEMATICAL MODELS; MOISTURE; RESIDUAL STRESSES; SHOCK ABSORBERS; THERMOSETS; VISCOELASTICITY;

QUAD FLAT NON-LEAD (QFN) PACKAGES; TEMPERATURE DEPENDENCE; VOLUMETRIC STRAINS;

SHEET MOLDING COMPOUNDS;

EID: 3843129585     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Yang, D.G. et al, "Vertical die crack stresses of Flip Chip induced in major package assembly processes", Micorelectronics Reliability (2000), pp. 1533-1538
2. Ernst, L.J. et al, "Time- and temperature dependent thermo-mechanical modeling of a packaging molding compound", J Electron Packaging 125 (2003), pp. 539-548
3. v. Driel, W.D. et al, "Packaging induced die stresses-Effect of chip anisotropy and time-dependent behaviour of moulding compound", J Electron Packaging 125 (2003), pp. 520-525
4. Ernst, L.J., et al, (2002) "Mechanical modeling and characterization of the curing process of underfill materials," Journal of Electronic Packaging, Vol.124 (2002). No. 2, pp. 97-105.
5. h Electronic Components and Technology Conference, Las Vegas, June 1-4 2004