Quasi-monolithic integration of high-power GaN-based HEMTs for high-frequency applications

Semiconductor Science and Technology

Volumn 22, Issue 11, 2007, Pages 1245-1248

  Kricke, Alexander ^a   Joodaki, Mojtaba ^a   Dharmarasu, Nethaji ^a   Kompa, Guenter ^a   Hillmer, Hartmut ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GALLIUM COMPOUNDS; HIGH FREQUENCY AMPLIFIERS; MICROMACHINING; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICES; SILICON; SUBSTRATES; THIN FILMS;

HIGH FREQUENCY; QUASI-MONOLITHIC INTEGRATION;

HIGH ELECTRON MOBILITY TRANSISTORS;

EID: 35648961436     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/22/11/011     Document Type: Article

References (10)

1. Lee J, Liu D, Kim H, Schuette M, Flynn J S, Brandes G R and Lu W 2004 Self-aligned AlGaN/GaN high electron mobility transistors Electron. Lett. 40 1227-8
2. Lee J W, Eastman L F and Webb K J 2003 A gallium-nitride push-pull microwave power ampflifier IEEE Trans. Microw. Theory Tech. 51 2243-9
3. Regoliosi P, Reale A, Carlo A D, Romanini P, Peroni M, Lanzieri C, Angelini A, Pirola M and Ghione G 2006 Experimental validation of GaN HEMTs thermal management by using photocurrent measurements IEEE Trans. Electron Devices 53 182-8
4. Robertson I D and Lucyszyn S 2001 RFIC and MMIC Design and Technology (London: Institution of Electrical Engineers) p 157
5. Sun J, Fatima H, Koudymov A, Chitnis A, Hu X, Wang H M, Zhang J, Simin G, Yang J and Khan M A 2003 Thermal management of AlGaN-GaN HFETs on sapphire using flip-chip bonding with epoxy underfill IEEE Electron Device Lett. 24 375-7
6. Joodaki M, Kompa G and Hillmer H 2003 An enhanced quasi-monolithic integration technology for microwave and millimeter wave applications IEEE Trans. Adv. Packag. 26 402-9
7. Joodaki M, Kompa G and Hillmer H 2005 Thermomechanical stress analysis and measurement in quasi-monolithic integration technology (QMIT) IEEE Trans. Device Mater. Reliab. 5 581-94
8. Joodaki M, Kricke A, Hillmer H and Kompa G 2006 Interconnects analyses in quasi-monolithic integration technology (QMIT) EPEP 2006: 15th Topical Meeting on Electrical Performance of Electronic Packaging (Scottsdale, USA)
9. Papapolymerou J, Ponchak G E, Dalton E, Bacon A and Tentzeris M M 2004 Crosstalk between finite ground coplanar waveguides over polyimide layers for 3-D MMICs on Si substrates IEEE Trans. Microw. Theory Tech. 52 1292-301
10. Tarraf A, Daleiden J, Irmer S, Prasai D and Hillmer H 2004 Stress investigation of PECVD dielectric layers for advanced optical MEMS J. Micromech. Microeng. 14 317-23