Interconnects analyses in Quasi-Monolithic Integration Technology (QMIT)

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2006, Pages 229-232

  Joodaki, M ^a   Kricke, A ^b   Hillmer, H ^b   Kompa, G ^b  

^a QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

^b UNIVERSITY OF KASSEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HIGH ENERGY PHYSICS; INTEGRATION; TECHNOLOGY; THREE DIMENSIONAL; WAVES;

ASSEMBLY TECHNOLOGIES; BOND WIRES; ELECTRICAL PERFORMANCES; ELECTROMAGNETIC (EM) SIMULATIONS; ELECTRONIC PACKAGING; FLIP CHIPPING; HIGH FREQUENCY PERFORMANCE; HYBRID INTEGRATION; MONOLITHIC INTEGRATIONS; NEW CONCEPT; THREE DIMENSIONAL (3D); WAVE FREQUENCY (WF);

MONOLITHIC INTEGRATED CIRCUITS;

EID: 50049121474     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2006.321236     Document Type: Conference Paper

References (3)

1. st, FL, USA, 2001, pp. 831-838.
2. D. D. Gupta, "A novel active area bumped flip-chip technology for convergent heat transfer from gallium arsenide power devices", IEEE Trans. on Components, Packaging and Manufacturing Technology A, vol. 18, issue 1, pp. 82-86, 1995.
3. M. Joodaki, G. Kompa, and H. Hillmer, "An enhanced quasi-monolithic integration technology (QMIT) for microwave and millimeterwave applications", The IEEE Trans. Advanced Packaging, vol. 26, No. 4, pp. 402-409, Nov. 2003.