Comprehensive modeling of stress-strain behavior for lead-free solder joints under board-level drop impact loading condition

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 528-535

  Che, F X ^a   Pang, John H L ^b   Zhu, W H ^a   Sun, Wei ^a   Sun, Anthony ^a   Wang, C K ^a   Tan, H B ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY ANALYSIS; STRAIN; STRESS ANALYSIS;

COMPREHENSIVE MODELING; DROP IMPACT LOADING; DROP TESTING; ELECTRONIC ASSEMBLY; SOLDER STRESS;

SOLDERED JOINTS;

EID: 35348904977     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373847     Document Type: Conference Paper

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