Study on Inter-Metallic Compound (IMC) at interface of Pb-free solder and nickel UBM for mobile application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1802-1808

  Choi, Joon Young ^a   Kang, In Soo ^a   Park, Byung Jin ^a   Park, Yun Mook ^a   Jung, Gi Jo ^a  

^a NEPES Corporation   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; MOBILE COMPUTING; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

HIGH TEMPERATURE STORAGE (HTS); ISOTHERMAL AGING; SHEAR STRENGTH DEGRADE; SOLDER JOINT RELIABILITY;

INTERMETALLICS;

EID: 35348887080     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374041     Document Type: Conference Paper

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