Investigation of IMC layer effect on PBGA solder joint thermal fatigue reliability

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 427-430

  Che, Fa Xing ^a   Pang, John H L ^a   Xu, Lu Hua ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); INTERMETALLICS; STIFFNESS; THERMAL CYCLING;

ELECTRONIC ASSEMBLY; FATIGUE RELIABILITY; NANOINDENTATION; SOLDER JOINT RELIABILITY;

SOLDERING ALLOYS;

EID: 33845579657     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Pang, H.L.J., Chong, D.Y.R., Low. T.H., "Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability", IEEE Trans. Compon. Packaging Technol, 24 (2001), pp. 705-712.
2. Cheng, Z.N., et al., "Viscoplastic Anand Model for Solder Alloys and Its Application", Solder. Surf. Mt. Technol, 12/2 (2000), pp. 31-36.
3. th Electronics Packaging Technology Conf, Singapore, December, 2004, pp.787-792.
4. Lucas, J.P., et al., "Mechanical Properties of Intermetallic Compounds Associated with Pb-free Solder Joints using nanoindentation", Journal of electronic Materials, Vol. 32, No. 12 (2003).
5. Chromik, R.R. et.al, "Nanoindentation Measurement on Cu-Sn and Ag-Sn Intermetallic Formed in Pb-free Solder Joints", Journal of Materials Research, 18 (2003), pp. 2251-2261.
6. th Electronic Components and Technology Conf, Lake Buena Vista, May 31-June 3, 2005, pp. 916-921.
7. th Electronic Components and Technology Conf, Las Vegas, June 1-4, 2004, pp. 1333-1337.
8. Pang, H.L.J., et al., "Microstructure and Intermetallic Growth effects on Shear and Fatigue of Solder Joints Subjected to Thermal Cycling Aging", Mater. Sci. Eng. A, 307 (2001), pp. 42-50.