Silicon microchannel cooling for high power chips

HVAC and R Research

Volumn 12, Issue 4, 2006, Pages 1031-1045

  Colgan, Evan G ^a   Furman, Bruce ^a   Gaynes, Mike ^a   LaBianca, Nancy ^a   Magerlein, John ^a   Polastre, Robert ^a   Bezama, R J ^b   Choudhary, Rehan ^b   Marston, Ken ^b   Toy, Hilton ^b   Wakil, Jamil A ^b   Schmidt, Roger ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINS (HEAT EXCHANGE); HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS;

INLET COOLING WATER; MULTIPLE HEAT EXCHANGER ZONES; OPTIMIZED COOLER FIN; SILICON MICROCHANNEL COOLERS; SILICON MICROCHANNEL COOLING;

COOLING WATER;

EID: 33750310526     PISSN: 10789669     EISSN: None     Source Type: Journal    
DOI: 10.1080/10789669.2006.10391449     Document Type: Article

References (9)

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