Convective performance of package based single phase microchannel heat exchanger

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 183-188

  Chang, Je Young ^a   Prasher, Ravi ^a,b   Chau, David ^a   Myers, Alan ^a   Dirner, John ^a   Prstic, Suzana ^a   He, Dongming ^a  

^a INTEL CORPORATION   (United States)

^b Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THERMAL MANAGEMENT; LIQUID COOLING; SILICON CHIPS;

CHANNEL FLOW; COOLING; HEATING; MICROPROCESSOR CHIPS; SILICON;

HEAT EXCHANGERS;

EID: 32844467267     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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