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Volumn , Issue , 2000, Pages 874-877

Fabrication and adhesion of low stress electroless Ni-Cu-P bump on copper pad

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ENERGY DISPERSIVE SPECTROSCOPY; GLOW DISCHARGES; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; NICKEL ALLOYS; PHOTOLITHOGRAPHY; SHEAR STRENGTH; SILICON WAFERS; TENSILE STRESS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

EID: 0034476749     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (21)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.