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Volumn , Issue , 2000, Pages 874-877
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Fabrication and adhesion of low stress electroless Ni-Cu-P bump on copper pad
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
ENERGY DISPERSIVE SPECTROSCOPY;
GLOW DISCHARGES;
INTERFACES (MATERIALS);
MAGNETRON SPUTTERING;
NICKEL ALLOYS;
PHOTOLITHOGRAPHY;
SHEAR STRENGTH;
SILICON WAFERS;
TENSILE STRESS;
THERMODYNAMIC STABILITY;
X RAY DIFFRACTION ANALYSIS;
DIMETHYLAMINE BORANE;
GLOW DISCHARGE SPECTROMETER;
SACCHARIN;
SOLDERABILITY;
ELECTRONICS PACKAGING;
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EID: 0034476749
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (21)
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