Dummy fill density analysis with coupling constraints

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2007, Pages 3-10

  Xiang, Hua ^a   Deng, Liang ^b   Puri, Ruchir ^a   Chao, Kai Yuan ^c   Wong, Martin D F ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

CMP; Coupling; Dummy fills

Indexed keywords

ALGORITHMS; CAPACITANCE; ELECTRIC WIRE; MATHEMATICAL MODELS; OPTIMIZATION; VLSI CIRCUITS;

COUPLING CAPACITANCE; COUPLING CONSTRAINED DUMMY FILL (CDF); COUPLING THRESHOLD; DUMMY FILL DENSITY ANALYSIS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 34748852012     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1231996.1232001     Document Type: Conference Paper

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