Topcoat-free photoresists for 193nm immersion lithography

Microlithography World

Volumn 16, Issue 3, 2007, Pages

  Sanders, Daniel P ^a   Sundberg, Linda K ^a   Sooriyakumaran, Ratnam ^a   Allen, Robert D ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; FLUORINE CONTAINING POLYMERS; HYDROPHOBICITY; LEACHING; PHOTORESISTS;

HYDROPHOBIC TOPCATS; IMMERSION LITHOGRAPHY;

LITHOGRAPHY;

EID: 34648830588     PISSN: 1074407X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (15)

1. A. K. Raub, et al., J. Vac. Sci. Technol. B. 22(6), pp. 3459-3464, 2004.
2. C. Wagner, et al., 3rd International Symposium on Immersion Lithography, Kyoto, Japan, 2006.
3. T. Fujiwara et al., ibid.
4. M. Kobayashi, et al., ibid.
5. Asahi Glass, Fujifilm, JSR, Rohm and Haas, and TOK, among others, have all publicly announced working on additive-based topcoat-free resists.
6. S. Schuetter, et al., J. Microlith., Microfab., Microsys. 5(2), 023002, April-June 2006.
7. M. Kocsis, et al., Proc. SPIE, 6154, 615409, 2006.
8. B. Streefkerk, et al., Proc. SPIE, 6154, 61540S, 2006.
9. R. Allen, et al., 3rd International Symposium on Immersion Lithography, Kyoto, Japan, 2006.
10. R. D. Allen, et al., J. Photopolym. Sci. Technol. 18(5),615-619, 2005.
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13. E.L. Jablonski et al., in Advances in Imaging Materials and Processes, H. Ito, P. R. Varanasi, M. Khojasteh, K-J. Chen, eds., pp. 95-100, 2004.
14. D.P. Sanders et al., Proc. SPIE, 6519, 651904, 2007.
15. K. Nakano et al., Proc. SPIE, 6519, 65190D, 2007.