Measurements of the dynamic contact angle for conditions relevant to immersion lithography

Journal of Microlithography, Microfabrication and Microsystems

Volumn 5, Issue 2, 2006, Pages

  Schuetter, Scott ^a   Shedd, Timothy ^a   Doxtator, Keith ^a   Nellis, Gregory ^a   Van Peski, Chris ^b   Grenville, Andrew ^c   Lin, Shang Ho ^d   Owe Yang, D C ^d  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

^b SEMATECH   (United States)

^c INTEL CORPORATION   (United States)

^d TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Dynamic contact angle; Immersion lithography; Liquid deposition

Indexed keywords

DYNAMIC CONTACT ANGLE; IMMERSION LITHOGRAPHY; LIQUID DEPOSITION;

DEPOSITION; FLUID DYNAMICS; LENSES; OPTICAL RESOLVING POWER; PHOTOLITHOGRAPHY; SILICON WAFERS;

CONTACT ANGLE;

EID: 33745804034     PISSN: 15371646     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.2198540     Document Type: Article

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