Investigation and improvement of fast temperature-cycle reliability for DMOS-related conductor path design

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2007, Pages 486-491

  Smorodin, Tobias ^a   Wilde, Jürgen ^b   Alpern, Peter ^a   Stecher, Matthias ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Aluminum metallization; Extrusion; Interlayer dielectric cracking; Power cycling; Short circuit

Indexed keywords

ALUMINUM; DEFORMATION; METALLIZING; RELIABILITY THEORY; SHORT CIRCUIT CURRENTS; STRESS ANALYSIS; TRANSISTORS; VISCOPLASTICITY;

ALUMINUM METALLIZATION; INTERLAYER DIELECTRIC CRACKING; POWER CYCLING;

MOS DEVICES;

EID: 34548789070     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2007.369939     Document Type: Conference Paper

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