Mechanical implications of high current densities in flip-chip solder joints

International Journal of Damage Mechanics

Volumn 13, Issue 4, 2004, Pages 335-345

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Electromigration; Phase coarsening; Reliability; Solder joint; Thermomigration

Indexed keywords

CRACKS; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; RELIABILITY; SCANNING ELECTRON MICROSCOPY;

PHASE COARSENING; SOLDER JOINT; THERMOMIGRATION;

SOLDERING ALLOYS;

EID: 7244244219     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1177/1056789504044282     Document Type: Article

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