In situ monitoring of additives in copper plating baths by cyclic voltammetric stripping with a microelectrode

Journal of the Electrochemical Society

Volumn 154, Issue 10, 2007, Pages

  Xie, Bu Gao ^a   Sun, Jian Jun ^a,b   Chen, Xiao Bo ^a   Chen, Jin Huai ^a   Xiang, Tong Ling ^a   Chen, Guo Nan ^a  

^a FUZHOU UNIVERSITY   (China)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); COPPER PLATING; CYCLIC VOLTAMMETRY; MASS TRANSFER; MICROELECTRODES; ROTATING DISKS;

COPPER PLATING BATHS; CYCLIC VOLTAMMETRIC STRIPPING (CVS); ROTATING DISK ELECTRODES (RDE);

ADDITIVES;

EID: 34548293857     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2761461     Document Type: Article

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