SCOPUS 정보 검색 플랫폼

Journal of Materials Science and Technology

Volumn 23, Issue 4, 2007, Pages 468-472

Reactive DC magnetron sputtering deposition of copper nitride thin film

(3) Li, Xing'ao a,b Liu, Zuli a Yao, Kailun a,c

a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

b HUBEI UNIVERSITY FOR NATIONALITIES (China)

c INSTITUTE OF GEOLOGY AND GEOPHYSICS (China)

Author keywords

Copper nitride thin film; DC magnetron sputtering; Microhardness; Resistivity

Indexed keywords

COPPER; DEPOSITION RATES; ELECTRIC CONDUCTIVITY; GROWTH (MATERIALS); GROWTH RATE; MAGNETRON SPUTTERING; MICROHARDNESS; NITRIDES; REACTIVE SPUTTERING; SPUTTER DEPOSITION; SUBSTRATES; SURFACE MORPHOLOGY; TEMPERATURE; THIN FILMS;

COPPER NITRIDE THIN FILM; DC MAGNETRON SPUTTERING; RESISTIVITY;

CRYSTAL STRUCTURE;

EID: 34547994799 PISSN: 10050302 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.