Ultraviolet cross-link gap fill materials and planarization applications for patterning metal trenches in 32-45nm via first dual damascene process

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 7 A, 2007, Pages 4074-4078

  Takei, Satoshi ^a   Shinjo, Tetsuya ^a   Horiguchi, Yusuke ^a  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

Author keywords

Dual damascene; Gap fill materials; Lithography; Planarization; UV cured materials

Indexed keywords

CROSSLINKING; CURING; LITHOGRAPHY; THERMAL EFFECTS;

DUAL DAMASCENE; GAP FILL MATERIALS; UV-CURED MATERIALS;

ULTRAVIOLET DEVICES;

EID: 34547842236     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.4074     Document Type: Article

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