Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor-package interaction simulations

Journal of Microelectromechanical Systems

Volumn 16, Issue 3, 2007, Pages 639-649

  Zhang, Xin ^a   Park, Seungbae ^b   Judy, Michael W ^a  

^a ANALOG DEVICES INC   (United States)

^b State University of New York at Binghamton   (United States)

Author keywords

Finite element analysis (FEA); MEMS sensor and package interaction (MPI); Offset; Plastic package; Stress; Warpage

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MEMS; OPTIMIZATION; THERMAL STRESS;

MEMS SENSORS; PACKAGING STRESS EFFECTS; THERMOMECHANICAL STRESSES;

SENSORS;

EID: 34547814286     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.897088     Document Type: Article

References (13)

1. M.W. Judy, "Evolution of integrated inertial MEMS technology," in Proc. Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, SC, Jun. 2004, pp. 27-32.
2. C. H. Yun, X. Zhang, J. Kuang, Y. Xu, and J. A. Geen, "Stress minimization in ceramic MEMS gyroscope packages," in Proc. IMAPS, Long Beach, CA, Nov. 2004, Session WP3-3.
3. S. Fischer, T. Fellner, J. Wilde, H. Beyer, and R. Janke, "Analyzing parameters influencing stress and drift in moulded hall sensors," in Proc. 1st Electron. Syst. Integration Technol. Conf., Sep. 2006, pp. 1378-1385.
4. X. Zhang, S. B. Park, R. Navarro, and M. W. Judy, "Accurate assessment of packaging stress effects on MEMS devices," in Proc. 10th ITHERM May 30-Jun. 2, 2006, pp. 1336-1342.
5. R. Darveaux, L. Norton, and F. Carney, "Temperature dependent mechanical behavior of plastic packaging materials," in Proc. 45th Electron. Compon. and Technol. Conf., May 1995, pp. 1054-1058.
6. K. M. B Jansen, L. Wang, C. van't Hof, L. J. Ernst, H. J. L. Bressers, and G. Q. Zhang, "Cure, temperature and time dependent constitutive modeling of moulding compounds," in Proc. 5th Int. Conf. Thermal and Mech. Simul. and Experiments Microelectron. and Microsyst., EuroSim, 2004, pp. 581-585.
7. L. E. Felton, M. Duffy, N. Hablutzel, P. W. Farrell, and W. A. Webster, "Low-cost packaging of inertial MEMS devices," in Proc. IMAPS, Boston, MA, Nov. 2003, pp. 402-406.
8. C. H. Yun, X. Zhang, W. A. Webster, T. Lor, and E. S. Lacsamana, "Micromachined accelerometer performance in plastic overmold packages," in Proc. IMAPS, Philadelphia, PA, Sep. 2005, pp. 143-147.
9. J. S. Kim, K. W. Paik, S. H. Oh, and H. S. Seo, "Thermo-mechanical stresses in laminated polymer films on silicon substrates," in Proc. 7th Int. Conf. Multichip Modules and High Density Packaging, Apr. 1998, pp. 449-453.
10. J. W. Y. Kong, J. K. Kim, and M. F. Yuen, "Warpage in plastic packages: Effects of process conditions, geometry and materials," IEEE Trans. Electron. Packag. Manuf., vol. 26, no. 3, pp. 245-252, Jul. 2003.
11. G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, H. Pape, and H. J. B. Peters, "Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's," IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 19, no. 2, pp. 296-300, May 1996.
12. R. B. R. van Silfhout, J. G. J. Beijer, K. Zhang, and W. D. van Driel, "Modelling methodology for linear elastic compound modelling versus visco-elastic compound modeling," in Proc. 6th Int. Conf. Thermal, Mech. and Multi-Physics Simul. and Experiments Micro-Electron. and Micro-Syst., EuroSim, Apr. 2005, pp. 483-489.
13. S. B. Park, S. Chung, H. Ackler, S. Mahkar, and P. Lin, "Structural reliability of SU-8 material for MEMS application," in Proc. ASME IMECE, Nov. 2005, pp. 251-258.