Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 2, 1996, Pages 296-299

  Kelly, Gerard ^b   Lyden, Colin ^a,b   Lawton, William ^b   Barrett, John ^a,b   Saboui, Alireza ^a,c   Pape, Heinz ^d   Peters, Henk J B ^e  

^a IEEE

^b UNIVERSITY COLLEGE CORK   (Ireland)

^c STMICROELECTRONICS   (Italy)

^d Dept HL BR MT A3 ^*  (Germany)

^e Fico Molding Systems   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SENSITIVITY ANALYSIS; SHEET MOLDING COMPOUNDS; SHRINKAGE; STRESSES; THERMAL EXPANSION;

PLASTIC QUAD FLAT PACKS; WARPAGE ANALYSIS; WARPAGE SENSITIVITY;

SURFACE MOUNT TECHNOLOGY;

EID: 0030142086     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.496032     Document Type: Article

References (11)

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