Low-Cost Packaging of Inertial MEMS Devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 402-406

  Felton, L E ^a   Duffy, M ^a   Hablutzel, N ^a   Farrell, P W ^a   Webster, W A ^a  

^a ANALOG DEVICES INC   (United States)

Author keywords

Accelerometer; MEMS packaging; Wafer capping; Wafer scale packaging

Indexed keywords

MICROELECTROMECHANICAL SYSTEMS PACKAGING; WAFER BONDING; WAFER CAPPING; WAFER-SCALE PACKAGING;

ACCELEROMETERS; COST EFFECTIVENESS; PACKAGING; SCREEN PRINTING; SEMICONDUCTOR DEVICES; TRANSFER MOLDING;

MICROELECTROMECHANICAL DEVICES;

EID: 2342531789     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

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2. R. Frank, M.L,. Kniffen and Lj. Ristic, "Packaging for Senors", in Sensor Technology and Devices, Artech House Publishers, Boston, Chapter 6, pp. 203-238, 1994.
3. T.A. Core, W.K. Tsang, and S.J. Sherman, "Fabrication Technology for an Integrated Surface Micromachined Sensor, Solid State Technology, Oct 1993
4. S. Bart,J. Chang, T. Core, T.;L.Foster, A. Olney, S. Sherman, S.W.Tsang, Design rules for a reliable surface micromachined IC sensor, Proceedings of the 33rd Annual 1995 IEEE International Reliability Physics Proceedings, Las Vegas, NV, USA, Apr 4-6 1995, p 311-317.