Analyzing parameters influencing stress and drift in moulded hall sensors

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 1378-1385

  Fischer, Sebastian ^a   Fellner, Thomas ^a   Wilde, Jürgen ^a   Beyer, Harald ^b   Janke, Ralf ^b  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Micronas GmbH Freiburg   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HALL EFFECT; LARGE SCALE SYSTEMS; MEMS; TEMPERATURE DISTRIBUTION;

HALL SENSORS; TEMPERATURE DEPENDENCY;

ELECTRONICS PACKAGING;

EID: 42549165991     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280191     Document Type: Conference Paper

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