Modelling methodology for linear elastic compound modelling versus visco-elastic compound modelling

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 483-489

  Van Silfhout, R B R ^a   Beijer, J G J ^a   Zhang, Kouchi ^a   Van Driel, W D ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STRESSES; THERMAL EFFECTS;

EPOXY MOLDING COMPOUND (EMC); PACKAGE RELIABILITY; THERMO-MECHANICAL PLASTIC-PACKAGE BEHAVIOR; VISCO-ELASTIC SIMULATIONS;

THERMOPLASTICS;

EID: 33745698107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502853     Document Type: Conference Paper

References (12)

1. Kiasat, M.S., "Curing shrinkage and residual stresses in visco-elastic thermosetting resins and composites", PhD-Thesis, Delft University of Technology, The Netherlands, 2000.
2. Jansen, K.M.B., Wang, L., van't Hof, C., Ernst, L.J., Bressers, H.J.L., Zhang, G.Q., "Cure, temperature and time dependent constitutive modeling of moulding compounds", Proc EuroSimE 2004, p. 581 -585.
3. Jansen, K.M.B., Wang, L., Yang, D.G., van't Hof, C., Ernst, L.J., Bressers, H.J.L., Zhang, G.Q., "Constitutive modeling of moulding compounds", Proc ECTC 04, p. 890 - 894.
4. Hof, C. van't, Wisse, G., Ernst, L.J., Jansen, K.M.B., Yang, D.G., Zhang, G.Q., Bressers, H.J.L., "A novel tool for cure dependent viscoelastic characterization of packaging polymers", Proc EuroSimE 2004, p. 385 - 390.
5. M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, H.J.L. Bressers, R.B.R. van Silfhout, X.J. Fan, J.H.J. Janssen, "Virtual Qualification of Moisture Induced Failures of Advanced Packages", Proc EuroSimE 2004, pp. 157-162.
6. G.Q. Zhang, "The challenges of virtual prototyping and qualification for future microelectronics"; Microelectronics Reliability, 43, 2003, pp. 1777-1785.
7. D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, "Modeling of Cure-Induced Warpage of Plastic IC Packages", Proc EuroSimE 2004, pp. 33 - 40.
8. D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, X.J. Fan, "Prediction of Process-Induced Warpage of IC Packages Encapsulated with Thermosetting Polymers", Proc ECTC 2004, p. 98-105.
9. D.G.Yang, et al, "Parameter sensitivity study of cure-dependent underfill properties on Flip Chip failures", Proc 52th Electronic Components and Technology Conference, San Diego, May 28-31, 2002, pp. 865-872.
10. J.H.J. Janssen, W.D. van Driel, J. Bisschop, F. Kuper, R.L. Schravendeel, Y. Li, H.J.L. Bressers, G.Q. Zhang, L.J. Ernst, M.S. Kiasat, Packaging Induced Die Stresses Considering Time-Dependent Behaviour of a Molding Compound", Proc EuroSimE 2001, pp. 227-231.
11. Ansys manual
12. Marc/Mentat manual