Accurate assessment of packaging stress effects on MEMS devices

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1336-1342

  Zhang, X ^a   Park, S B ^b   Navarro, R ^a   Judy, M W ^a  

^a ANALOG DEVICES INC   (United States)

^b State University of New York at Binghamton   (United States)

Author keywords

Finite element analysis (FEA); MEMS; MEMS sensor package PCB interaction (MPPI); Offset; Plastic package; Stress; Warpage

Indexed keywords

ACCELEROMETERS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSENSORS; STRESSES;

OFFSET; PLASTIC PACKAGE; THERMO MECHANICAL STRESSES; WARPAGE;

MICROELECTROMECHANICAL DEVICES;

EID: 33845575113     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645500     Document Type: Conference Paper

References (10)

1. M. W. Judy, "Evolution of integrated inertial MEMS technology," Invited Speech, Solid-state Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, South Carolina, June 2004.
2. C. H. Yun, X. Zhang, J. Kuang, Y. Xu, and J. A. Geen, "Stress minimization in ceramic MEMS gyroscope packages," Proceedings of International Microelectronics and Packaging Society Conference (IMAPS'2004), Long Beach, CA, November 2004.
3. th Electronic Components and Technology Conference, May 1995.
4. th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSim 2004, 2004, pp.581 - 585.
5. L. E. Felton, M. Duffy, N. Hablutzel, P. W. Farrell, and W. A. Webster, "Low-cost packaging of inertial MEMS devices," Proceedings of International Microelectronics and Packaging Society Conference (IMAPS'2003), Boston, MA, November 2003.
6. C. H. Yun, X. Zhang, W. A. Webster, T. Lor, E. S. Lacsamana, "Micromachined accelerometer performance in plastic overmold packages," Proceedings of International Microelectronics and Packaging Society Conference (IMAPS'2005), Philadelphia, PA, September 2005.
7. th International Conference on Multichip Modules and High Density Packaging, April 1998, pp. 449-453.
8. J. W. Y. Kong, J. K. Kim, M. F. Yuen, "Warpage in plastic packages: effects of process conditions, geometry and materials," IEEE Transactions on Electronics Packaging Manufacturing, Vol.26, No.3, July 2003 pp.245 - 252.
9. G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, H. Pape, H. J. B. Peters, "Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFP's," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol.19, No.2, May 1996 pp. 296 - 300.
10. th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSim 2005, April 2005.