Measuring the fracture toughness of ultra-thin films with application to AlTa coatings

International Journal of Fracture

Volumn 144, Issue 3, 2007, Pages 173-179

  Xiang, Yong ^a,b   McKinnell, James ^c   Ang, Wie Ming ^c   Vlassak, Joost J ^a  

^a HARVARD UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

^c HEWLETT PACKARD COMPANY   (United States)

Author keywords

Bulge test; Fracture toughness; Thin films

Indexed keywords

ALUMINUM ALLOYS; BRITTLENESS; COATINGS; CRACKS; FOCUSED ION BEAMS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MATERIALS TESTING;

BRITTLE THIN FILMS; BULGE TEST; INTERMETALLIC FILM; PRE-CRACK LENGTH;

ULTRATHIN FILMS;

EID: 34547769211     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-007-9095-0     Document Type: Article

References (22)

1. Bagdahn J, Sharpe WN and Jadaan O (2003). Fracture strength of polysilicon at stress concentrations. J Microelectromech Syst 12: 302
2. Ballarini R, Mullen RL, Yin Y, Kahn H, Stemmer S and Heuer AH (1997). The fracture toughness of polysilicon microdevices: A first report. J Mater Res 12: 915
3. Beams JW (1959) Mechanical properties of thin films of gold and silver. In: Neugebauer CA, Newkirk JB, and Vermilyea DA (eds) Structure and properties of thin films. John Wiley and Sons, Inc., p 183
4. Beuth JL (1991). Cracking of thin bonded films in residual tension. Int J Solids Struct 29: 1657
5. Broek D (1989). Elementary engineering fracture mechanics. Kluwer Academic Publishers, Dordrecht
6. Chasiotis I and Knauss WG (2003). The mechanical strength of polysilicon films: Part 2. Size effects associated with elliptical and circular perforations. J Mech Phys Solids 51: 1551
7. Espinosa HD and Peng B (2005). A new methodology to investigate fracture toughness of freestanding MEMS and advanced materials in thin film form. J Microelectromech Syst 14: 153
8. He J, Xu G, Suo Z (2004) Experimental determination of crack driving forces in integrated structures. In: Ho PS, Baker SP, Nakamura T, Volkert CA (eds) In: Proceedings of the 7th international workshop on stress-induced phenomena in metallization, Austin, Texas, June 2004, pp 3-14, American Institute of Physics, New York
9. Ina K and Koizumi H (2004). Penetration of liquid metals into solid metals and liquid metal embrittlement. Mater Sci Eng A 387: 390-394
10. Inglis CE (1913). Stresses in a plate due to the presence of cracks and sharp corners. Transac Inst Naval Architects 55: 219
11. Kahn H, Ballarini R, Mullen RL and Heuer AH (1999). Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens. Proc Roy Soc Lond A 455: 3807
12. Kahn H, Tayebi N, Ballarini R, Mullen RL and Heuer AH (2000). Fracture toughness of polysilicon MEMS devices. Sensors Actuators A 82: 274
13. 2 and AlTa. J Alloy Compd 201: 167
14. Pugno N, Peng B and Espinosa HD (2005). Predictions of strength in MEMS components with defects - a novel experimental-theoretical approach. Int J Solids Struct 42: 647
15. Sigle W, Richter G, Ruhle M and Schmidt S (2006). Insight into the atomic-scale mechanism of liquid metal embrittlement. J Appl Phys 89: 121911
16. Su PJ and Chung CK (2005). Amorphization of Ta-Al films using magnetron sputtering. Surf Coat Technol 200: 1664
17. Subramanian PR, Miracle DB and Mazdiyasni S (1990). Phase-relationships in the Al-Ta System. Metallurgic Transac 21A: 539
18. Tabata O, Kawahata K, Sugiyama S and Igarashi I (1989). Mechanical property measurement of thin films using load-deflection of composite rectangular membranes. Sensors Actuators 20: 135
19. Vlassak JJ and Nix WD (1992). A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films. J Mater Res 7: 3242
20. Wellner P, Kraft O, Dehm G, Andersons J and Arzt E (2004). Channel cracking of β-NiAl thin films on Si substrates. Acta Materialia 52: 2325
21. Xiang Y, Chen X and Vlassak JJ (2005). The plane-strain bulge test for thin films. J Mater Res 20: 2360
22. Ziegler JF, Biersack JP and Littmark U (1985). The stopping and range of ions in matter. Pergamon Press, New York