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Acta Materialia

Volumn 52, Issue 8, 2004, Pages 2325-2336

Channel cracking of β-NiAl thin films on Si substrates

(5) Wellner, P a Kraft, O b Dehm, G a Andersons, J c Arzt, E a

a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS (Germany)

b KARLSRUHE INSTITUTE OF TECHNOLOGY (Germany)

c UNIVERSITY OF LATVIA (Latvia)

Author keywords

Cracking; Fracture toughness; Nickel aluminides; Thermal stresses; Thin films

Indexed keywords

BRITTLENESS; CRACK INITIATION; DUCTILITY; ELASTICITY; FRACTURE TOUGHNESS; INTERMETALLICS; NICKEL COMPOUNDS; NUMERICAL ANALYSIS; OXIDATION; POLYCRYSTALLINE MATERIALS; PROTECTIVE COATINGS; TENSILE STRESS; THERMAL STRESS; THIN FILMS;

CRACKING; NICKEL ALUMINIDES;

SILICON;

EID: 1942455911 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2004.01.023 Document Type: Article

Times cited : (41)

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