Step coverage of thin titania films on patterned silicon substrate by pulsed-pressure MOCVD

Surface and Coatings Technology

Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 8944-8949

  Siriwongrungson, Vilailuck ^a   Alkaisi, Maan M ^a   Krumdieck, Susan P ^a  

^a UNIVERSITY OF CANTERBURY   (New Zealand)

Author keywords

Conformality; Features; Pulsed MOCVD; Step coverage; TiO2

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; METALLIC FILMS; SCANNING ELECTRON MICROSCOPY; STATISTICAL METHODS; SURFACE MORPHOLOGY; TEMPERATURE; TITANIUM DIOXIDE; X RAY DIFFRACTION ANALYSIS;

SILICON SUBSTRATE; THIN TITANIA FILMS; TITANIUM TETRA-ISOPROPOXIDE (TTIP);

METALLORGANIC CHEMICAL VAPOR DEPOSITION;

ENERGY DISPERSIVE SPECTROSCOPY; METALLIC FILMS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; STATISTICAL METHODS; SURFACE MORPHOLOGY; TEMPERATURE; TITANIUM DIOXIDE; X RAY DIFFRACTION ANALYSIS;

EID: 34547676768     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.03.051     Document Type: Article

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